Last Tuesday at SEMICON West, the Facilities 450mm Consortium hosted a panel of representatives from F450C and G450C member companies to provide an update on fab facilities and infrastructure progress in preparing for the transition from 300mm substrates to 450mm. As the F450C Program Manager, I was honored to moderate the panel which included David Skilbred, Director of Program Coordination/Management, G450C (Intel assignee); Ben Peek, F450C Project Architect from Haws; Lothar Till, Managing Director for Ovivo Switzerland; Paul Alers, Head of Product Management for Busch Vacuum; and Joe Guerin, Head of Sales and Marketing for CS CLEAN SYSTEMS (read more).
from left: Joe Guerin, Head of Sales and Marketing for CS CLEAN SYSTEMS; Todd Fosler, F450C Program Manager; Paul Alers, Head of Product Management for Busch Vacuum; Lothar Till, Managing Director for Ovivo Switzerland; Ben Peek, F450C Project Architect from Haws; and David Skilbred, Director of Program Coordination/Management, G450C (Intel assignee)
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