In transitioning from 300mm to 450mm wafer processing, the surface area of each wafer approximately doubles and so the mass of direct materials used in deposition and etch chambers can be expected to increase accordingly. Consequently, the cost to deliver and abate process chemicals will likewise double…unless we re-examine how our process tools are integrated into our fab facilities. The abatement of toxic effluent gases from deposition and etch chambers is an ongoing challenge for fabs, and there are different “optimal” solutions depending on whether we take a unit-process or a total-fab perspective… read more
